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  datasheet www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. R8005ANX nch 800v 5a power mosfet 4) drive circuits can be simple. 2) fast switching speed. tape width (mm) - 3) gate-source voltage (v gss ) guaranteed to be ? 30v. ? application reel size (mm) 6) pb-free lead plating ; rohs compliant bulk - type packaging 500 taping code 800v 2.08 ? 51w 5a 5) parallel use is easy. v dss r ds(on) (max.) i d p d 1) low on-resistance. ? outline ? inner circuit ? packaging specifications to-220fm v gss ? 20 continuous drain current basic ordering unit (pcs) pulsed drain current gate - source voltage parameter t c = 100c switching power supply ? 5 value t c = 25c symbol ? absolute maximum ratings (t a = 25c) drain - source voltage - marking R8005ANX ? features unit 800 v dss i d *1 a vv ? 30 v/ns 150 reverse diode dv/dt i ar *3 range of storage temperature t stg power dissipation (t c = 25c) c w junction temperature a dv/dt *5 15 ? 55 to ? 150 i d,pulse *2 i d *1 ? 2.4 aa t j c mj e ar *4 avalanche energy, single pulse avalanche energy, repetitive avalanche current 2.5 e as *3 1.3 mj p d 51 1.66 (1) (3) (2) (1) gate (2) drain (3) source ? 1 body diode ? 1 (1) (2) (3) 1/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX drain - source voltage slope dv/dt v ds = 640v, i d = 5a - typ. symbol conditions values ? absolute maximum ratings ? thermal resistance thermal resistance, junction - case parameter max. parameter i gss -n a t j = 125c vv 0.1 ? a 1000? 100 - - t j = 25c drain - source avalanchebreakdown voltage - 800 conditions symbol v (br)ds - min. values typ. 100 - zero gate voltagedrain current v (br)dss v gs = 0v, i d = 2.5a v gs = 0v, i d = 1ma i dss unit t sold r thja min. r thjc symbol - unit c/w values v/ns t j = 125c 50 - 2.41 - c - 265 c/w unit max. - 900 - -7 0 gate threshold voltage v gs (th) v ds = 10v, i d = 1ma 3 gate - source leakage current v gs = ? 30v, v ds = 0v --v 5 thermal resistance, junction - ambientsoldering temperature, wavesoldering for 10s ? electrical characteristics (t a = 25c) parameter drain - source breakdownvoltage v ds = 800v, v gs = 0v ? gate input resistance r g f = 1mhz, open drain - 7.7 - static drain - sourceon - state resistance ? t j = 25c - 1.60 2.08 t j = 125c - r ds(on) *6 v gs = 10v, i d = 2.5a 3.69 - 2/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX *1 limited only by maximum temperature allowed.*2 p w ? 10 ? s, duty cycle ? 1% *3 l ? 500 ? h, v dd = 50v, r g = 25 ? , starting t j = 25c *4 l ? 500 ? h, v dd = 50v, r g = 25 ? , starting t j = 25c, f = 10khz *5 reference measurement circuits fig.5-1.*6 pulsed 7.4 - v gate plateau voltage v (plateau) v dd ? 400v, i d = 5a -- gate - drain charge q gd *6 parameter ? gate charge characteristics (t a = 25c) rise time t r *6 i d = 2.5a symbol values 17 v gs = 10v - 4.4 - min. 21 - conditions total gate chargegate - source charge q gs *6 i d = 5a q g *6 v dd ? 400v 11 - - typ. ns 37 74 41 82 - - max. unit nc - r g = 10 ? - turn - off delay time t d(off) *6 r l = 160 ? - fall time t f *6 - pf - 16.8 - - 41.2 turn - on delay time t d(on) *6 v dd ? 400v, v gs = 10v - effective output capacitance,energy related effective output capacitance, time related c o(er) c o(tr) v gs = 0v v ds = 0v to 640v 17 485 - g fs *6 v ds = 10v, i d = 2.5a pf - c rss f = 1mhz - 21 - 250 max. reverse transfer capacitance ? electrical characteristics (t a = 25c) parameter symbol conditions values unit min. typ. 2 transconductanceinput capacitance 1 output capacitance c oss v ds = 25v - -s c iss v gs = 0v - 3/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX peak reverse recovery current parameter symbol conditions values reverse recovery charge t rr *6 - - 16.5 - q rr *6 i rrm *6 i s *1 i sm *2 t c = 25c ? body diode electrical characteristics (source-drain)(t a = 25c) -4 . 6- ? c v sd *6 v gs = 0v, i s = 5a typ. forward voltage reverse recovery time unit min. max. inverse diode continuous, forward current inverse diode direct current, pulsed - i s = 5a di/dt = 100a/ ? s 554 --- 0.00169 k/w ws/k r th2 0.966 c th2 0.0194 0.258 c th1 r th1 r th3 2.18 c th3 0.461 peak rate of fall of reverse recovery current di rr /dt - value ? typical transient thermal characteristics 30 - symbol value unit symbol -a a/ ? s - t j = 25c unit - aa 1.5 v ns 20 5 4/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? electrical characteristic curves 0.0001 0.001 0.01 0.1 1 10 100 1000 0.0001 0.01 1 100 t a = 25oc single pulser th(ch-a)(t) = (t) r th(ch-a) r th(ch-a) = 70oc/w top d = 1 d = 0.5 d = 0.1 d = 0.05 d = 0.01 d = single 0 20 40 60 80 100 120 0 50 100 150 200 0.001 0.01 0.1 1 10 100 0.1 1 10 100 1000 t a =25oc single pulse p w = 100 ? s p w = 1ms p w = 10ms operation in this area is limited by r ds (on) (v gs = 10v) fig.1 power dissipation derating curve fig.2 maximum safe operating area power dissipation : p d /p d max. [%] drain current : i d [a] junction temperature : t j [ c] drain - source voltage : v ds [v] fig.3 normalized transient thermal resistance vs. pulse width normalized transient thermal resistance : r (t) pulse width : p w [s] 5/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? electrical characteristic curves 0 0.5 1 1.5 2 2.5 3 3.5 4 0.01 0.1 1 10 100 t a = 25oc v dd = 50v, r g = 25 ? v gf = 10v, v gr = 0v 0 200 400 600 800 1000 1200 1400 1600 1800 2000 1.0e+04 1.0e+05 1.0e+06 t a =25oc 0 20 40 60 80 100 120 0 25 50 75 100 125 150 175 fig.4 avalanche current vs inductive load avalanche current : i ar [a] coil inductance : l [mh] fig.5 avalanche power losses avalanche power losses : p ar [w] frequency : f [hz] fig.6 avalanche energy derating curve vs junction temperature avalanche energy : e as / e as max. [%] junction temperature : t j [oc] 6/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? electrical characteristic curves 0 1 2 3 4 5 0 1 02 03 04 05 0 t a =150oc pulsed v gs = 10.0v v gs = 4.5v v gs = 8.0v v gs = 7.0v v gs = 6.5v v gs = 6.0v v gs = 5.0v v gs = 5.5v 0 0.2 0.4 0.6 0.8 1 012345 t a =150oc pulsed v gs = 10.0v v gs = 4.5v v gs = 8.0v v gs = 7.0v v gs = 6.5v v gs = 6.0v v gs = 5.0v v gs = 5.5v 0 0.2 0.4 0.6 0.8 1 012345 t a =25oc pulsed v gs = 10.0v v gs = 4.5v v gs = 8.0v v gs = 7.0v v gs = 6.5v v gs = 6.0v v gs = 5.0v fig.7 typical output characteristics(i) fig.8 typical output characteristics(ii) fig.9 t j = 150 c typical output characteristics(i) fig.10 t j = 150 c typical output characteristics(ii) drain - source voltage : v ds [v] drain - source voltage : v ds [v] drain current : i d [a] drain current : i d [a] drain current : i d [a] drain - source voltage : v ds [v] drain current : i d [a] drain - source voltage : v ds [v] 0 1 2 3 4 5 0 1 02 03 04 05 0 v gs = 10.0v v gs = 4.5v v gs = 8.0v v gs = 7.0v v gs = 6.5v v gs = 6.0v t a =25oc pulsed 7/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? electrical characteristic curves 700 750 800 850 900 950 1000 1050 1100 -50 -25 0 25 50 75 100 125 150 2 3 4 5 6 -50-25 0 255075100125150 v ds = 10v plused 0.01 0.1 1 10 0.01 0.1 1 10 v ds = 10v plused t a = ? 25oc t a =25oc t a =75oc t a =125oc fig.12 typical transfer characteristics fig.11 breakdown voltage vs. junction temperature drain - source breakdown voltage : v (br)dss [v] drain current : i d [a] fig.13 gate threshold voltage vs. junction temperature gate threshold voltage : v gs(th) [v] junction temperature : t j [ c ] fig.14 transconductance vs. drain current transconductance : g fs [s] drain current : i d [a] junction temperature : t j [ c ] gate - source voltage : v gs [v] 0.001 0.01 0.1 1 10 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 v ds = 10v plused t a =125oc t a =75oc t a =25oc t a = ? 25oc 8/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? electrical characteristic curves 0 1 2 3 4 5 0 2 4 6 8 10 12 14 16 18 20 i d = 2.5a i d = 5.0a t a =25oc pulsed 0 2 4 6 8 10 -50-25 0 255075100125150 v gs = 10v plused i d = 2.5a i d = 5.0a fig.15 static drain - source on - state resistance vs. gate source voltage static drain - source on-state resistance : r ds(on) [ ? ] gate - source voltage : v gs [v] fig.16 static drain - source on - state resistance vs. junction temperature static drain - source on-state resistance : r ds(on) [ ? ] junction temperature : t j [oc] fig.17 static drain - source on - state resistance vs. drain current static drain - source on-state resistance : r ds(on) [ ? ] drain current : i d [a] 0.1 1 10 0.01 0.1 1 10 v gs = 10v plused t a =125oc t a =75oc t a =25oc t a = ? 25oc 9/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? electrical characteristic curves 1 10 100 1000 10000 0.01 0.1 1 10 t r t f t d(on) t d(off) v dd P 400v v gs = 10v r g = 10 ? t a = 25oc pulsed 0 2 4 6 8 10 12 0 5 10 15 20 25 30 t a = 25oc v dd = 400v i d = 5a pulsed fig.18 typical capacitance vs. drain - source voltage capacitance : c [pf] drain - source voltage : v ds [v] fig.20 switching characteristics switching time : t [ns] drain current : i d [a] fig.21 dynamic input characteristics total gate charge : q g [nc] gate - source voltage : v gs [v] coss stored energy : e oss [uj] fig.19 coss stored energy drain - source voltage : v ds [v] 1 10 100 1000 10000 0.01 0.1 1 10 100 1000 c oss c rss c iss t a =25oc f = 1mhz v gs = 0v 0 1 2 3 4 5 6 7 8 0 200 400 600 800 t a =25oc 10/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? electrical characteristic curves fig.22 inverse diode forward current vs. source - drain voltage inverse diode forward current : i s [a] source - drain voltage : v sd [v] fig.23 reverse recovery time vs.inverse diode forward current reverse recovery time : t rr [ns] inverse diode forward current : i s [a] 0.01 0.1 1 10 0.0 0.5 1.0 1.5 v gs =0v pulsed t a =125oc t a =75oc t a =25oc t a = ? 25oc 100 1000 0.1 1 10 t a =25oc v gs = 0v di / dt = 100a / ? s pulsed 11/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? measurement circuits fig.1-1 switching time measurement circuit fig.1-2 switching waveforms fig.2-1 gate charge measurement circuit fig.2-2 gate charge waveform fig.3-1 avalanche measurement circuit fig.3-2 avalanche waveform fig.4-1 dv/dt measurement circuit fig.4-2 dv/dt waveform fig.5-1 di/dt measurement circuit fig.5-2 di/dt waveform v gs i g(const.) v ds d.u.t. i d r l v dd 90% 90% 90% 10% 10% 50% 10% 50% v gs pulse width v ds t on t off t r t d(on) t f t d(off) v gs r g v ds d.u.t. i d r l v dd v g v gs charge q g q gs q gd v gs r g v ds d.u.t. i as lv dd i as v dd v (br)dss i as 2 l e as = v (br)dss - v dd v (br)dss 12 v gs r g v ds d.u.t. i as lv dd driver mosfet r g d.u.t. l i f v dd t rr i rr 100% i rr i f 0 i rr 90% d rr / d t i rr 10% i as v dd v (br)dss 12/13 2016.02 - rev.b downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet R8005ANX ? dimensions (unit : mm) dimension in mm / inches e a a a x a a p a to-220fm ax ax a a a a e p x t 13/13 2016.02 - rev.b downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class  class  class  b class  class ? class  2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///


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